E-vapor device including heater structure with recessed shell layer

ABSTRACT

An e-vapor device may include a pre-vapor sector and a heater structure arranged in thermal contact with the pre-vapor sector. The pre-vapor sector is configured to hold and dispense a pre-vapor formulation. The heater structure includes a base wire and a shell layer coating the base wire. The base wire is insulated from the shell layer. The shell layer includes at least one recessed portion between a first unrecessed portion and a second unrecessed portion. The at least one recessed portion is a thinner section of the shell layer that is configured to vaporize the pre-vapor formulation to generate a vapor. As a result of the heater design, the heater structure is stiffer and more robust than other related heaters in the art, thus allowing more options for its implementation.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a continuation under 35 U.S.C. § 120 of U.S.application Ser. No. 15/208,969, filed Jul. 13, 2016, which claimspriority under 35 U.S.C. § 119 to U.S. Provisional Application No.62/198,365, filed Jul. 29, 2015, the entire contents of each of whichare hereby incorporated herein by reference.

BACKGROUND Field

The present disclosure relates to e-vapor devices and heater structuresfor such devices.

Description of Related Art

Electronic vapor devices are electrically-powered articles configured tovaporize a pre-vapor formulation for the purpose of producing a vaporthat is drawn through an outlet of the device when a negative pressureis applied. Electronic vapor devices may also be referred to as e-vapordevices or e-vaping devices. An e-vapor device includes a reservoirconfigured to hold the pre-vapor formulation, a wick that is arranged incommunication with the pre-vapor formulation, a heating element that isarranged in thermal proximity to the wick, and a power source configuredto supply electricity to the heating element. The heating element may bein a form of a relatively thin wire that is coiled a plurality of timesaround the wick. Accordingly, when a current is supplied to the heatingelement during the operation of the e-vapor device, the wire undergoesresistive heating to vaporize the pre-vapor formulation in the wick toproduce a vapor that is drawn through an outlet of the device when anegative pressure is applied.

SUMMARY

An e-vapor device may include a pre-vapor sector and a heater structurearranged in thermal contact with the pre-vapor sector. The pre-vaporsector is configured to hold and dispense a pre-vapor formulation. Theheater structure includes a base wire and a shell layer coating the basewire. The base wire is insulated from the shell layer. The shell layermay include at least one recessed portion between a first unrecessedportion and a second unrecessed portion. The at least one recessedportion is a thinner section of the shell layer that is configured tovaporize the pre-vapor formulation to generate a vapor.

The pre-vapor sector may include a reservoir and a dispensing interface.The at least one recessed portion of the shell layer may be arranged topress against the dispensing interface of the pre-vapor sector. Theheater structure may have a yield strength ranging from 50 to 600 MPa.

The base wire of the heater structure may be an anodized wire. Theanodized wire may be an object wire coated with an anodic layer. Theobject wire may be an aluminum wire, a titanium wire, a zinc wire, amagnesium wire, a niobium wire, a zirconium wire, a hafnium wire, or atantalum wire. The anodic layer may have a dielectric strength of atleast 150 V. The anodic layer may have a thickness ranging from 500 to10,000 nm.

Alternatively, the base wire may be a transition metal-based wire coatedwith vitreous enamel. The transition metal-based wire may be a nickelwire, a nickel-chromium wire, or a stainless steel wire.

The first unrecessed portion is separated from the second unrecessedportion by the at least one recessed portion of the shell layer. The atleast one recessed portion may be configured to reach a temperature thatis at least double a temperature of the first and second unrecessedportions when a current flows through the shell layer. A thickness ofthe at least one recessed portion of the shell layer may range from 0.01to 1 μm. A thickness of the first and second unrecessed portions of theshell layer may range from 10 to 100 μm. The first and second unrecessedportions of the shell layer are connected to opposite terminals of apower source. The at least one recessed portion of the shell layer has aresistivity ranging from 0.02 to 0.2μΩ·m. The shell layer may be formedof platinum or gold.

The at least one recessed portion may be in a form of a first recessedportion and a second recessed portion. The first and second recessedportions may be between opposite sides of the first and secondunrecessed portions. The first and second recessed portions coil aroundthe base wire.

A method of generating a vapor for an e-vapor device may includethermally contacting a pre-vapor sector within the e-vapor device with aheater structure. The heater structure may include a base wire and ashell layer coating the base wire. The base wire is insulated from theshell layer. The shell layer may include at least one recessed portionbetween a first unrecessed portion and a second unrecessed portion. Thethermally contacting may include heating a pre-vapor formulation of thepre-vapor sector with the at least one recessed portion of the shelllayer to generate the vapor.

BRIEF DESCRIPTION OF THE DRAWINGS

The various features and advantages of the non-limiting embodimentsherein may become more apparent upon review of the detailed descriptionin conjunction with the accompanying drawings. The accompanying drawingsare merely provided for illustrative purposes and should not beinterpreted to limit the scope of the claims. The accompanying drawingsare not to be considered as drawn to scale unless explicitly noted. Forpurposes of clarity, various dimensions of the drawings may have beenexaggerated.

FIG. 1A is a partial, perspective view of a heater structure having ashell layer with a recessed portion according to an example embodiment.

FIG. 1B is a cross-sectional view of the heater structure of FIG. 1A.

FIG. 2A is a partial, perspective view of a heater structure having ashell layer with a first recessed portion and a second recessed portionaccording to an example embodiment.

FIG. 2B is a side view of the heater structure of FIG. 2A.

FIG. 2C is a cross-sectional view of the heater structure of FIG. 2A.

FIG. 3 is a cross-sectional view of an e-vapor device including a heaterstructure according to an example embodiment.

FIG. 4 is an enlarged view of the portion of the e-vapor deviceincluding the heater structure of FIG. 3.

FIG. 5 is a perspective view of a heater structure having a loop shapeand unrecessed portions extending in opposite directions according to anexample embodiment.

FIG. 6 is a perspective view of a heater structure having a loop shapeand unrecessed portions extending in the same direction according to anexample embodiment.

FIG. 7 is a perspective view of a heater structure having a winding formthat resembles a polygonal shape according to an example embodiment.

FIG. 8 is a perspective view of a heater structure having a winding formthat resembles a circular shape according to an example embodiment.

DETAILED DESCRIPTION

It should be understood that when an element or layer is referred to asbeing “on,” “connected to,” “coupled to,” or “covering” another elementor layer, it may be directly on, connected to, coupled to, or coveringthe other element or layer or intervening elements or layers may bepresent. In contrast, when an element is referred to as being “directlyon,” “directly connected to,” or “directly coupled to” another elementor layer, there are no intervening elements or layers present. Likenumbers refer to like elements throughout the specification. As usedherein, the term “and/or” includes any and all combinations of one ormore of the associated listed items.

It should be understood that, although the terms first, second, third,etc. may be used herein to describe various elements, components,regions, layers and/or sections, these elements, components, regions,layers, and/or sections should not be limited by these terms. Theseterms are only used to distinguish one element, component, region,layer, or section from another region, layer, or section. Thus, a firstelement, component, region, layer, or section discussed below could betermed a second element, component, region, layer, or section withoutdeparting from the teachings of example embodiments.

Spatially relative terms (e.g., “beneath,” “below,” “lower,” “above,”“upper,” and the like) may be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as illustrated in the figures. It should be understood thatthe spatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. For example, if the device in thefigures is turned over, elements described as “below” or “beneath” otherelements or features would then be oriented “above” the other elementsor features. Thus, the term “below” may encompass both an orientation ofabove and below. The device may be otherwise oriented (rotated 90degrees or at other orientations) and the spatially relative descriptorsused herein interpreted accordingly.

The terminology used herein is for the purpose of describing variousembodiments only and is not intended to be limiting of exampleembodiments. As used herein, the singular forms “a,” “an,” and “the” areintended to include the plural forms as well, unless the context clearlyindicates otherwise. It will be further understood that the terms“includes,” “including,” “comprises,” and/or “comprising,” when used inthis specification, specify the presence of stated features, integers,steps, operations, elements, and/or components, but do not preclude thepresence or addition of one or more other features, integers, steps,operations, elements, components, and/or groups thereof.

Example embodiments are described herein with reference tocross-sectional illustrations that are schematic illustrations ofidealized embodiments (and intermediate structures) of exampleembodiments. As such, variations from the shapes of the illustrations asa result, for example, of manufacturing techniques and/or tolerances,are to be expected.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which example embodiments belong. Itwill be further understood that terms, including those defined incommonly used dictionaries, should be interpreted as having a meaningthat is consistent with their meaning in the context of the relevant artand will not be interpreted in an idealized or overly formal senseunless expressly so defined herein.

FIG. 1A is a partial, perspective view of a heater structure having ashell layer with a recessed portion according to an example embodiment.Referring to FIG. 1A, the heater structure 114 is a compound arrangementin that the heater structure 114 is composed of at least two differentconstituent parts. As a result of the heater design, the heaterstructure 114 is stiffer and more robust than other related heaters inthe art, thus allowing more options for its implementation.Additionally, because FIG. 1A is only a partial view of the heaterstructure 114, it should be understood that the heater structure 114 mayhave various lengths and forms when implemented for its intendedpurpose.

The heater structure 114 may be utilized in an e-vapor device. Inparticular, the heater structure 114 may be arranged so as to be inthermal contact with a pre-vapor sector of the e-vapor device, whereinthe pre-vapor sector is configured to hold and dispense a pre-vaporformulation. A pre-vapor formulation is a material or combination ofmaterials that may be transformed into a vapor. For example, thepre-vapor formulation may be a liquid, solid, and/or gel formulationincluding, but not limited to, water, beads, solvents, activeingredients, ethanol, plant extracts, natural or artificial flavors,and/or vapor formers such as glycerine and propylene glycol. In anexample embodiment, the pre-vapor formulation may be an e-liquid that isheld and dispensed by a liquid sector. During the operation of thee-vapor device, the heater structure 114 is configured to vaporize thepre-vapor formulation to generate a vapor that is drawn through anoutlet of the device (e.g., in response to the application of a negativepressure).

As shown in FIG. 1A, the heater structure 114 includes a base wire 123and a shell layer 119 coating the base wire 123. The shell layer 119 isformed of a material that is relatively non-reactive and capable ofundergoing resistive heating to vaporize a pre-vapor formulation. Forinstance, the shell layer 119 may be formed of platinum (Pt) or gold(Au), although example embodiments are not limited thereto. The basewire 123 is insulated from the shell layer 119. The shell layer 119includes a recessed portion 122 between a first unrecessed portion 120 aand a second unrecessed portion 120 b. In an example embodiment, thefirst unrecessed portion 120 a is separated from the second unrecessedportion 120 b by the recessed portion 122 of the shell layer 119. Therecessed portion 122 is a thinner section of the shell layer 119 that isconfigured to vaporize the pre-vapor formulation to generate a vapor.The thickness of the recessed portion 122 of the shell layer 119 mayrange from 0.01 to 1 μm, while the thickness of the first unrecessedportion 120 a and the second unrecessed portion 120 b of the shell layer119 may range from 10 to 100 μm. The shell layer 119 may be depositedvia sputtering, and the recessed portion 122 can be formed with a maskpattern, although example embodiments are not limited thereto.

To operate the heater structure 114, the first unrecessed portion 120 aand the second unrecessed portion 120 b of the shell layer 119 areconnected to opposite terminals of a power source (e.g., battery). Forinstance, the first unrecessed portion 120 a of the shell layer 119 maybe connected to a positive terminal of a power source, while the secondunrecessed portion 120 b of the shell layer 119 may be connected to anegative terminal of the power source. Conversely, the first unrecessedportion 120 a of the shell layer 119 may be connected to a negativeterminal of a power source, while the second unrecessed portion 120 b ofthe shell layer 119 may be connected to a positive terminal of the powersource.

When a current is supplied to the shell layer 119, heat is generated (asa result of the passage of the current therethrough) by Joule heating,which is also referred to in the art as ohmic heating or resistiveheating. In particular, an electric current passing through the shelllayer 119 encounters resistance, which is the opposition to the passageof the electric current therethrough, thus resulting in the heating ofthe shell layer 119, particularly at the recessed portion 122. Forinstance, the recessed portion 122 may be configured to reach atemperature that is at least double a temperature of the firstunrecessed portion 120 a and the second unrecessed portion 120 b when acurrent flows through the shell layer 119, although example embodimentsare not limited thereto.

The resistance of a given object depends primarily on the material andthe shape of the object. For a given material, the resistance isinversely proportional to the cross-sectional area. For instance, athick wire of a particular metal will have a lower resistance than athin wire of that same metal. Additionally, for a given material, theresistance is proportional to the length. Consequently, a short wire ofa particular metal will have a lower resistance than a long wire of thatsame metal.

The resistance R of a conductor of uniform cross section can beexpressed as

${R = {\rho \frac{L}{A}}},$

where ρ is the resistivity (Ω·m), L is the length of the conductor (m),and A is the cross-sectional area of the conductor (m²). The aboveequation may also be rearranged and expressed in terms of resistivity ρ,wherein

$\rho = {\frac{RA}{L}.}$

Resistivity ρ is a measure of a given material's ability to oppose theflow of electric current and varies with temperature. Resistivity ρ isan intrinsic property, unlike resistance R. In particular, the wires ofa given material (irrespective of their shape and size) will haveapproximately the same resistivity, but a long, thin wire of the givenmaterial will have a much larger resistance than a thick, short wire ofthat same material. Every material has its own characteristicresistivity. Thus, the resistivity of a wire at a given temperaturedepends only on the material used to form the wire and not on thegeometry of the wire.

The recessed portion 122 of the shell layer 119 in FIGS. 1A-1B may havea resistivity of about 0.02 to 0.2μΩ·m (e.g., about 0.08 to 0.14μΩ·m orabout 0.1 μΩ·m). Additionally, the recessed portion 122 of the shelllayer 119 may have a resistance of about 1 to 10Ω (e.g., about 3 to 8Ω).As a result, when a current flows through the shell layer 119 from thefirst unrecessed portion 120 a to the second unrecessed portion 120 b(or vice versa), heat will be generated in the recessed portion 122 dueto the higher resistance in the thinner recessed portion 122 relative tothe thicker first unrecessed portion 120 a and second unrecessed portion120 b of the shell layer 119. Accordingly, the pre-vapor formulationwill be vaporized by the recessed portion 122 (rather than the first andsecond unrecessed portions 120 a and 120 b) of the shell layer 119.

The base wire 123 is insulated from the shell layer 119. As a result,the loss of the supplied current from the shell layer 119 and thedissipation of the generated heat from the recessed portion 122 thereofto the base wire 123 can be reduced or prevented. To achieve thepertinent insulation from the shell layer 119, the base wire 123 may bean anodized wire. In an example embodiment, the anodized wire is anobject wire 124 coated with an anodic layer 126 (e.g., oxide layer). Theobject wire 124 may have a diameter of up to about 400 μm (e.g., about100-400 μm). Also, the object wire 124 may be an aluminum wire, atitanium wire, a zinc wire, a magnesium wire, a niobium wire, azirconium wire, a hafnium wire, or a tantalum wire. However, it shouldbe understood that the object wire 124 may be formed of other suitablemetals that are capable of being anodized to grow the anodic layer 126thereon. The anodic layer 126 has a thickness of at least 500 nm (e.g.,at least 1000 nm). Additionally, the anodic layer 126 may have athickness of up to 10,000 nm. In furtherance of the reduction orprevention of the above-mentioned loss of the supplied current from theshell layer 119 and the dissipation of the generated heat from therecessed portion 122 thereof to the base wire 123, the anodic layer 126may be grown so as to have a dielectric strength of at least 150 V.

Alternatively, to achieve the pertinent insulation from the shell layer119, the base wire 123 may be a transition metal-based wire (e.g., 124)coated with vitreous enamel (e.g., 126). The transition metal-based wiremay be a nickel wire, a nickel-chromium wire, or a stainless steel wire,although example embodiments are not limited thereto.

It should be understood that the heater structure 114 may be implementedin a variety of shapes, sizes, and forms. For instance, in an e-vapordevice, the heater structure 114 may be loop-shaped, ring-shaped, orC-shaped to allow the use of a wick that is in elongated form (e.g.,cord). In such an example, the wick would extend through theloop-shaped, ring-shaped, or C-shaped heater structure while alsoarranged in fluidic communication with the reservoir. Additionally, thewick may be thicker than those in the related art, thereby reducing orpreventing the likelihood of clogging. Furthermore, the stronger andmore robust nature of the heater structure 114 allows this structure tosqueeze the wick to a greater degree than possible with other relatedheaters in the art.

Alternatively, the heater structure 114 may be arranged so as to apply aspring force against the dispensing interface of the pre-vapor sector.The dispensing interface may include a wick that is in planar form(e.g., pad) and in fluidic communication with the reservoir. In such anexample, the heater structure 114 (e.g., recessed portion 122 of theshell layer 119) would press against the dispensing interface of thepre-vapor sector. For instance, the heater structure 114 may have ayield strength of about 50 to 600 MPa to allow the desired amount ofpressure to be applied to the dispensing interface. The base wire 123may be primarily responsible for the yield strength of the heaterstructure 114. Furthermore, to increase the contact area with thedispensing interface, the heater structure 114 may be provided with awinding pattern.

A method of generating a vapor for an e-vapor device may includethermally contacting a pre-vapor sector within the e-vapor device with aheater structure. The pre-vapor sector includes a reservoir and adispensing interface. The dispensing interface may be in a form of anabsorbent material that is arranged in fluidic communication with thereservoir and the heater structure. In particular, the pre-vaporformulation within the pre-vapor sector may directly contact the heaterstructure. The heater structure includes a base wire and a shell layercoating the base wire. The base wire is insulated from the shell layer.In an example embodiment, the base wire is electrically insulated (butnot thermally insulated) from the shell layer. The shell layer includesa recessed portion between a first unrecessed portion and a secondunrecessed portion. The thermally contacting step may include heatingthe pre-vapor formulation of the pre-vapor sector with the recessedportion of the shell layer to generate the vapor.

FIG. 1B is a cross-sectional view of the heater structure of FIG. 1A.Referring to FIG. 1B, the object wire 124 is electrically isolated fromthe shell layer 119 by the anodic layer 126. As a result, even when theobject wire 124 and the shell layer 119 are conductors, the loss ofcurrent from the shell layer 119 to the object wire 124 can be mitigatedor precluded by the anodic layer 126. Additionally, although the heaterstructure 114 in FIGS. 1A-1B appears as a stout, cylindrical structure(by virtue of the partial view thereof), it should be understood thatthe heater structure 114 can be relatively long and the underlying basewire 123 can be deformed to provide various foundational shapes andforms for the shell layer 119 to coat. In an example embodiment, thelength of the recessed portion 122 (e.g., 20 mm) may be longer than acombined length of the first and second unrecessed portions 120 a and120 b (e.g., 2 mm each) by about be five times or more. Furthermore, amajority (e.g., 90% or more) of the mass of the shell layer 119 may bein the first and second unrecessed portions 120 a and 120 b.

FIG. 2A is a partial, perspective view of a heater structure having ashell layer with a first recessed portion and a second recessed portionaccording to an example embodiment. Referring to FIG. 2A, the heaterstructure 214 includes a base wire 223 and a shell layer 219 coating thebase wire 223. The base wire 223 may be an anodized wire. In an exampleembodiment, the anodized wire is an object wire 224 coated with ananodic layer 226. The object wire 224 may be insulated from the shelllayer 219 by the anodic layer 226. The base wire 223 corresponds to thebase wire 123 of FIGS. 1A-1B. Furthermore, the above-discussed aspectsand considerations in connection with the shell layer 119 of FIGS. 1A-1Bmay also apply to the shell layer 219.

The shell layer 219 includes a first recessed portion 222 a and a secondrecessed portion 222 b. The first and second recessed portions 222 a and222 b may originate from opposite surfaces of the shell layer 219 andcoil around the base wire 223 so as to form alternately-arranged spiralgrooves (e.g., double helix arrangement). As a result, first unrecessedportion 220 a and the second unrecessed portion 220 b are separated fromeach other by the first recessed portion 222 a and the second recessedportion 222 b. In particular, the first and second recessed portions 222a and 222 b are between opposite sides of the first and secondunrecessed portions 220 a and 220 b. Although FIG. 2A shows a relativelyclose-coiled arrangement for the heater structure 214, it should beunderstood that the arrangement may be more open such that the size ofthe recessed portions is increased so as to decrease the number of coilsthereof.

To operate the heater structure 214, the first unrecessed portion 220 aand the second unrecessed portion 220 b of the shell layer 219 areconnected to opposite terminals of a power source (e.g., battery). Whena current flows from the first unrecessed portion 220 a to the secondunrecessed portion 220 b (or vice versa), the first and second recessedportions 222 a and 222 b therebetween undergo resistive heating tofacilitate the generation of a vapor. In an example embodiment, one ormore wicks may be arranged in fluidic communication with the pre-vaporsector and also wrapped around the heater structure 214 so as to seatwithin the first recessed portion 222 a and/or the second recessedportions 222 b. In such an embodiment, the size of the first recessedportion 222 a and the second recessed portions 222 b can be modified asneeded to accommodate the one or more wicks (or vice versa). The wickmay also be in a form of a strip of an absorbent material to facilitateits positioning within the first recessed portion 222 a and/or thesecond recessed portions 222 b. Furthermore, one of the ends of theheater structure 214 may be angled so as to form a puncture device thatis designed to pierce a container (e.g., capsule) of a pre-vaporformulation and, thus, place one or more wicks in fluidic communicationwith the pre-vapor formulation.

FIG. 2B is a side view of the heater structure of FIG. 2A. FIG. 2C is across-sectional view of the heater structure of FIG. 2A. Referring toFIGS. 2B-2C, the unrecessed portions alternate between the first andsecond unrecessed portions 220 a and 220 b along the length of theheater structure 214. Similarly, the recessed portions alternate betweenthe first and second recessed portions 222 a and 222 b along the lengthof the heater structure 214.

FIG. 3 is a cross-sectional view of an e-vapor device including a heaterstructure according to an example embodiment. Referring to FIG. 3, ane-vapor device 60 includes a first section 70 coupled to a secondsection 72 via a threaded connection 205. The first section 70 may be areplaceable cartridge, and the second section 72 may be a reusablefixture, although example embodiments are not limited thereto. Thethreaded connection 205 may be a combination of a male threaded memberon the first section 70 and a female threaded receiver on the secondsection 72 (or vice versa). Alternatively, the threaded connection 205may be in a form of other suitable structures, such as a snug-fit,detent, clamp, and/or clasp arrangement. The first section 70 includesan outer tube 6 (or housing) extending in a longitudinal direction andan inner tube 62 within the outer tube 6. The inner tube 62 may becoaxially positioned within the outer tube 6. The second section 72 mayalso include the outer tube 6 (or housing) extending in a longitudinaldirection. In an alternative embodiment, the outer tube 6 can be asingle tube housing both the first section 70 and the second section 72,and the entire e-vapor device 60 can be disposable.

The e-vapor device 60 includes a central air passage 20 defined in partby the inner tube 62 and an upstream seal 15. Additionally, the e-vapordevice 60 includes a reservoir 22. The reservoir 22 is configured tohold a pre-vapor formulation and optionally a storage medium operable tostore the pre-vapor formulation therein. In an example embodiment, thereservoir 22 is contained in an outer annulus between the outer tube 6and the inner tube 62. The outer annulus is sealed by the seal 15 at anupstream end and by a stopper 10 at a downstream end so as to preventleakage of the pre-vapor formulation from the reservoir 22.

A heater structure 14 is contained in the inner tube 62 downstream ofand in a spaced apart relation to the portion of central air passage 20defined by the seal 15. The heater structure 14 may be as described inconnection with the heater structure 114 in FIGS. 1A-1B and can be inthe form of a loop, although example embodiments are not limitedthereto. A wick 28 is in communication with the pre-vapor formulation inthe reservoir 22 and in communication with the heater structure 14 suchthat the wick 28 dispenses the pre-vapor formulation in proximaterelation to the heater structure 14. Thus, the wick 28 may be regardedas a dispensing interface for the pre-vapor formulation. The combinationof at least the reservoir 22 and the dispensing interface (e.g., wick28) may be regarded as the pre-vapor sector.

The wick 28 may be constructed of a fibrous and flexible material. Inparticular, the wick 28 may include at least one filament having acapacity to draw a pre-vapor formulation into the wick 28. For example,the wick 28 may include a bundle of filaments, such as glass (orceramic) filaments. In another instance, the wick 28 may include abundle comprising a group of windings of glass filaments (e.g., three ofsuch windings), all which arrangements are capable of drawing apre-vapor formulation into the wick 28 via capillary action as a resultof the interstitial spacing between the filaments. A power supply 1 inthe second section 72 is operably connected to the heater structure 14to apply a voltage across the heater structure 14. The e-vapor device 60also includes at least one air inlet 44 operable to deliver air to thecentral air passage 20 and/or other portions of the inner tube 62.

The e-vapor device 60 further includes a mouth-end insert 8 having atleast two off-axis, diverging outlets 24. The mouth-end insert 8 is influidic communication with the central air passage 20 via the interiorof inner tube 62 and a central passage 63, which extends through thestopper 10. The heater structure 14 is configured to heat the pre-vaporformulation to a temperature sufficient to vaporize the pre-vaporformulation and form a vapor. Other orientations of the heater structure14 (other than that shown in the drawings) are contemplated. Forinstance, although the heater structure 14 is shown as being arrangedcentrally within the inner tube 62, it should be understood that theheater structure 14 can also be arranged adjacent to an inner surface ofthe inner tube 62.

The wick 28, reservoir 22, and mouth-end insert 8 are contained in thefirst section 70, and the power supply 1 is contained in the secondsection 72. In an example embodiment, the first section (e.g.,cartridge) 70 is disposable, and the second section (e.g., fixture) 72is reusable. The first section 70 and second section 72 can be attachedby a threaded connection 205, whereby the first section 70 can bereplaced when the pre-vapor formulation in the reservoir 22 is depleted.Having a separate first section 70 and second section 72 provides anumber of advantages. First, if the first section 70 contains the heaterstructure 14, the reservoir 22, and the wick 28, all elements which arepotentially in contact with the pre-vapor formulation are disposed ofwhen the first section 70 is replaced. Thus, there will be nocross-contamination between different mouth-end inserts 8 (e.g., whenusing different pre-vapor formulations). Also, if the first section 70is replaced at suitable intervals, there is less chance of the heaterstructure 14 becoming clogged with the pre-vapor formulation.Optionally, the first section 70 and the second section 72 may bearranged to releaseably lock together when engaged.

Although not shown, the outer tube 6 can include a clear (transparent)window formed of a transparent material so as to allow an adult vaper tosee the amount of pre-vapor formulation remaining in the reservoir 22.The clear window can extend at least a portion of the length of thefirst section 70 and can extend fully or partially about thecircumference of the first section 70. In another example embodiment,the outer tube 6 can be at least partially formed of a transparentmaterial so as to allow an adult vaper to see the amount of pre-vaporformulation remaining in the reservoir 22.

The at least one air inlet 44 may include one, two, three, four, five,or more air inlets. If there is more than one air inlet, the air inletsmay be located at different locations along the e-vapor device 60. Forexample, an air inlet 44 a can be positioned at the upstream end of thee-vapor device 60 adjacent a puff sensor 16 such that the puff sensor 16facilitates the supply of power to the heater structure 14 upon sensinga negative pressure applied by the adult vaper. The air inlet 44 a is incommunication with the mouth-end insert 8 such that a draw upon themouth-end insert 8 will activate the puff sensor 16. During a draw by anadult vaper, the air from the air inlet 44 a will flow along the powersupply 1 (e.g., battery) to the central air passage 20 in the seal 15and/or to other portions of the inner tube 62 and/or outer tube 6. Theat least one air inlet can be located adjacent to and upstream of theseal 15 or at any other desirable location. Altering the size and numberof air inlets can also aid in establishing the desired resistance todraw (RTD) of the e-vapor device 60.

The heater structure 14 is arranged to communicate with the wick 28 andto heat the pre-vapor formulation contained in the wick 28 to atemperature sufficient to vaporize the pre-vapor formulation and form avapor. The heater structure 14 may be a loop-type arrangementsurrounding the wick 28. Examples of suitable electrically resistivematerials for the heater structure 14 include titanium, zirconium,tantalum, and metals from the platinum group. Examples of suitable metalalloys include stainless steel, nickel-, cobalt-, chromium-, aluminum-,titanium-, zirconium-, hafnium-, niobium-, molybdenum-, tantalum-,tungsten-, tin-, gallium-, manganese-, and iron-containing alloys, andsuper-alloys based on nickel, iron, cobalt, and stainless steel. Forinstance, the heater structure 14 may include nickel aluminides, amaterial with a layer of alumina on the surface, iron aluminides, andother composite materials. The electrically resistive material mayoptionally be embedded in, encapsulated, or coated with an insulatingmaterial or vice-versa, depending on the kinetics of energy transfer andthe external physicochemical properties required. In a non-limitingembodiment, the heater structure 14 comprises at least one materialselected from the group consisting of stainless steel, copper, copperalloys, nickel-chromium alloys, superalloys, and combinations thereof.In another non-limiting embodiment, the heater structure 14 includesnickel-chromium alloys or iron-chromium alloys. Furthermore, the heaterstructure 14 can include a ceramic portion having an electricallyresistive layer on an outside surface thereof. A higher resistivity forthe heater structure 14 lowers the current draw or load on the powersupply (battery) 1.

The heater structure 14 may heat the pre-vapor formulation in the wick28 by thermal conduction. Alternatively, the heat from the heaterstructure 14 may be conducted to the pre-vapor formulation by means of aheat conductive element or the heater structure 14 may transfer the heatto the incoming ambient air that is drawn through the e-vapor device 60during use, which in turn heats the pre-vapor formulation by convection.

The wick 28 extends through opposing openings in the inner tube 62 suchthat the end portions 31 of the wick 28 are in contact with thepre-vapor formulation in the reservoir 22. The filaments of the wick 28may be generally aligned in a direction transverse to the longitudinaldirection of the e-vapor device 60, although example embodiments are notlimited thereto. During the operation of the e-vapor device 60, the wick28 draws the pre-vapor formulation from the reservoir 22 to the heaterstructure 14 via capillary action as a result of the interstitialspacing between the filaments of the wick 28. The wick 28 can includefilaments having a cross-section which is generally cross-shaped,clover-shaped, Y-shaped, or in any other suitable shape. The capillaryproperties of the wick 28, combined with the properties of the pre-vaporformulation, can be tailored to ensure that the wick 28 will be wet inthe area of the heater structure 14 to avoid overheating. The wick 28and the optional fibrous storage medium (of the reservoir 22) may beconstructed from an alumina ceramic. Alternatively, the wick 28 mayinclude glass fibers, and the optional fibrous storage medium mayinclude a cellulosic material or polyethylene terephthalate.

The power supply 1 may include a battery arranged in the e-vapor device60 such that the anode is downstream from the cathode. A battery anodeconnector 4 contacts the downstream end of the battery. The heaterstructure 14 is connected to the battery by two spaced apart electricalleads. The connection between the end portions 27 and 27′ of the heaterstructure 14 and the electrical leads are highly conductive andtemperature resistant, while the heater structure 14 is highly resistiveso that heat generation occurs primarily along the heater structure 14and not at the contacts.

The battery may be a Lithium-ion battery or one of its variants (e.g., aLithium-ion polymer battery). The battery may also be a Nickel-metalhydride battery, a Nickel cadmium battery, a Lithium-manganese battery,a Lithium-cobalt battery, or a fuel cell. The e-vapor device 60 isusable until the energy in the power supply 1 is depleted, after whichthe power supply 1 will need to be replaced. Alternatively, the powersupply 1 may be rechargeable and include circuitry allowing the batteryto be chargeable by an external charging device. In this rechargeableembodiment, the circuitry, when charged, provides power for a desired orpre-determined number of applications of negative pressure, after whichthe circuitry must be re-connected to an external charging device.

The e-vapor device 60 also includes control circuitry including the puffsensor 16. The puff sensor 16 is operable to sense an air pressure dropand to initiate the application of voltage from the power supply 1 tothe heater structure 14. The control circuitry includes a heateractivation light 48 operable to glow when the heater structure 14 isactivated. The heater activation light 48 may include an LED and may bearranged at an upstream end of the e-vapor device 60 so that the heateractivation light 48 takes on the appearance of a burning coal during theapplication of negative pressure. Alternatively, the heater activationlight 48 can be arranged on the side of the e-vapor device 60 so as tobe more visible to the adult vaper and/or to provide a desired aestheticappeal. The heater activation light 48 may have various shapes, sizes,quantities, and configurations. For instance, the heater activationlight 48 may have a circular, elliptical, or polygonal shape (for one ormore such lights). In another instance, the heater activation light 48may have a linear or annular form that is continuous or segmented. Forexample, the heater activation light may be provided as an elongatedstrip that extends along the body of the e-vapor device 60. In anotherexample, the heater activation light 48 may be provided as a ring thatextends around the body of the e-vapor device 60. The ring may be in thefirst section 70 or the second section 72 (e.g., adjacent to theupstream end). It should be understood that the heater activation light48 can be arranged on the end(s) and/or the sides of the e-vapor device60. Furthermore, the heater activation light 48 can be utilized fore-vapor system diagnostics. The heater activation light 48 can also beconfigured such that the adult vaper can activate and/or deactivate theheater activation light 48 for privacy, such that, if desired, theheater activation light 48 would not activate during vaping.

The control circuitry integrated with the puff sensor 16 mayautomatically supply power to the heater structure 14 in response to thepuff sensor 16, for example, with a maximum, time-period limiter.Alternatively, the control circuitry may include a manually operableswitch for an adult vaper to initiate vaping. The time-period of theelectric current supply to the heater structure 14 may be pre-setdepending on the amount of pre-vapor formulation desired to bevaporized. The control circuitry may be programmable for this purpose.The control circuitry may supply power to the heater structure 14 aslong as the puff sensor 16 detects a pressure drop.

When activated, the heater structure 14 heats a portion of the wick 28surrounded by the heater structure 14 for less than about 10 seconds(e.g., less than about 7 seconds). Thus, the power cycle (or maximumlength for the continuous application of negative pressure) can rangefrom about 2 seconds to about 10 seconds (e.g., about 3 seconds to about9 seconds, about 4 seconds to about 8 seconds, or about 5 seconds toabout 7 seconds).

The reservoir 22 may at least partially surround the central air passage20, and the heater structure 14 and the wick 28 may extend betweenportions of the reservoir 22. The optional storage medium within thereservoir 22 may be a fibrous material including cotton, polyethylene,polyester, rayon, and combinations thereof. The fibers may have adiameter ranging in size from about 6 microns to about 15 microns (e.g.,about 8 microns to about 12 microns or about 9 microns to about 11microns). Also, the fibers may be sized to be irrespirable and can havea cross-section with a Y shape, cross shape, clover shape, or any othersuitable shape. Instead of fibers, the optional storage medium may be asintered, porous, or foamed material. Furthermore, it should beunderstood that the reservoir 22 may just be a filled tank lacking afibrous storage medium.

The pre-vapor formulation has a boiling point suitable for use in thee-vapor device 60. If the boiling point is too high, the heaterstructure 14 may not be able to adequately vaporize the pre-vaporformulation in the wick 28. Conversely, if the boiling point is too low,the pre-vapor formulation may prematurely vaporize without the heaterstructure 14 even being activated.

The pre-vapor formulation may be a tobacco-containing material includingvolatile tobacco flavor compounds which are released from the pre-vaporformulation upon heating. The pre-vapor formulation may also be atobacco flavor containing material or a nicotine-containing material.Alternatively, or in addition thereto, the pre-vapor formulation mayinclude a non-tobacco material. For instance, the pre-vapor formulationmay include water, solvents, active ingredients, ethanol, plantextracts, and natural or artificial flavors. The pre-vapor formulationmay further include a vapor former. Examples of suitable vapor formersare glycerine, propylene glycol, etc.

During vaping, the pre-vapor formulation is transferred from thereservoir 22 to the proximity of the heater structure 14 by capillaryaction via the wick 28. The wick 28 has a first end portion and anopposite second end portion 31. The first end portion and the second endportion 31 extend into opposite sides of the reservoir 22 to contact thepre-vapor formulation contained therein. The heater structure 14surrounds at least a portion of the wick 28 such that when the heaterstructure 14 is activated, the pre-vapor formulation in that portion(e.g., central portion) of the wick 28 is vaporized by the heaterstructure 14 to form a vapor.

The reservoir 22 may be configured to protect the pre-vapor formulationtherein from oxygen so that the risk of degradation of the pre-vaporformulation is significantly reduced. Additionally, the outer tube 6 maybe configured to protect the pre-vapor formulation from light so thatthe risk of degradation of the pre-vapor formulation is significantlyreduced.

The mouth-end insert 8 include at least two diverging outlets 24 (e.g.,3, 4, 5, or more). The outlets 24 of the mouth-end insert 8 are locatedat the ends of off-axis passages and are angled outwardly in relation tothe longitudinal direction of the e-vapor device 60. As used herein, theterm “off-axis” denotes at an angle to the longitudinal direction of thee-vapor device. Also, the mouth-end insert (or flow guide) 8 may includeoutlets uniformly distributed around the mouth-end insert 8 so as tosubstantially uniformly distribute the vapor in an adult vaper's mouthduring vaping. Thus, as the vapor passes into an adult vaper's mouth,the vapor moves in different directions so as to provide a full mouthfeel as compared to e-vapor devices having an on-axis single orificewhich directs the vapor to a single location in an adult vaper's mouth.

The outlets 24 and off-axis passages are arranged such that droplets ofunvaporized pre-vapor formulation (carried in the vapor impact interiorsurfaces 81 at the mouth-end insert 8 and/or interior surfaces of theoff-axis passages) are removed or broken apart. The outlets 24 of themouth-end insert 8 are located at the ends of the off-axis passages andmay be angled at 5 to 60 degrees with respect to the central axis of theouter tube 6 so as to remove droplets of unvaporized pre-vaporformulation and to more completely distribute the vapor throughout amouth of an adult vaper during vaping. Each outlet 24 may have adiameter of about 0.015 inch to about 0.090 inch (e.g., about 0.020 inchto about 0.040 inch or about 0.028 inch to about 0.038 inch). The sizeof the outlets 24 and off-axis passages along with the number of outlets24 can be selected to adjust, if desired, the resistance to draw (RTD)of the e-vapor device 60.

An interior surface 81 of the mouth-end insert 8 may be a generallydomed surface. Alternatively, the interior surface 81 of the mouth-endinsert 8 may be generally cylindrical or frustoconical with a planar endsurface. The interior surface 81 may be substantially uniform over thesurface thereof or symmetrical about the longitudinal axis of themouth-end insert 8. However, the interior surface 81 can alternativelybe irregular and/or have other shapes.

The mouth-end insert 8 may be integrally affixed within the outer tube 6of the first section 70. The mouth-end insert 8 may be formed of apolymer selected from the group consisting of low density polyethylene,high density polyethylene, polypropylene, polyvinylchloride,polyetheretherketone (PEEK), and combinations thereof. The mouth-endinsert 8 may also be colored if desired.

The e-vapor device 60 may also include an air flow diverter. The airflow diverter is operable to manage the air flow at or around the heaterstructure 14 so as to abate a tendency for drawn air to cool the heaterstructure 14, which could otherwise lead to diminished vapor output. Inan example embodiment, an air flow diverter may include an imperviousplug at a downstream end of the central air passage 20 in seal 15. Thecentral air passage 20 is an axially extending central passage in seal15 and inner tube 62. The seal 15 seals the upstream end of the annulusbetween the outer tube 6 and the inner tube 62. The air flow divertermay include at least one radial air channel to direct the air from thecentral air passage 20 outward towards the inner tube 62 and into anouter air passage 9 defined between an outer periphery of a downstreamend portion of the seal 15 and the inner wall of inner tube 62.

The diameter of the bore of the central air passage 20 may besubstantially the same as the diameter of the at least one radial airchannel. The diameter of the bore of the central air passage 20 and theat least one radial air channel may range from about 1.5 mm to about 3.5mm (e.g., about 2.0 mm to about 3.0 mm). Optionally, the diameter of thebore of the central air passage 20 and the at least one radial airchannel can be adjusted to control the resistance to draw (RTD) of thee-vapor device 60. During vaping, the air flows into the bore of thecentral air passage 20, through the at least one radial air channel, andinto the outer air passage 9 such that a lesser portion of the air flowis directed at a central portion of the heater structure 14 so as toreduce or minimize the cooling effect of the airflow on the heaterstructure 14 during the heating cycles. Thus, the incoming air isdirected away from the center of the heater structure 14 and the airvelocity past the heater structure 14 is reduced as compared to when theair flows through a central opening in the seal 15 oriented directly inline with a middle portion of the heater structure 14.

FIG. 4 is an enlarged view of the portion of the e-vapor deviceincluding the heater structure of FIG. 3. Referring to FIGS. 3-4, theheater structure 14 is a loop-type arrangement with the wick 28extending therethrough. The principle of heater structure 14 in FIGS.3-4 may be as described in connection with the heater structure 114 inFIGS. 1A-1B. In particular, the base wire and shell layer of the heaterstructure 14 in FIGS. 3-4 correspond to the base wire 123 and shelllayer 119 of the heater structure 114 in FIGS. 1A-1B, respectively.Notably, the base wire 123 in FIGS. 1A-1B is configured as a loop inFIGS. 3-4. Additionally, the shell layer 119 in FIGS. 1A-1B is coatedaround the loop in FIGS. 3-4. Furthermore, as shown in FIGS. 3-4, oneunrecessed portion extends upward to connect to a positive (or negative)terminal of the power supply 1 via an electrical lead, while theopposing unrecessed portion extends downward to connect to a negative(or positive) terminal of the power supply 1 via another electricallead.

As shown in FIGS. 3-4, the wick 28 extends through the opening of theloop-type arrangement of the heater structure 14. The end portions 31 ofthe wick 28 also extend through the inner tube 62 so as to be in fluidiccommunication with the pre-vapor formulation in the reservoir 22. As aresult, when a current is supplied to the heater structure 14 from thepower supply 1, the recessed portions of the shell layer will undergoresistive heating and vaporize the pre-vapor formulation in the wick 28to produce a vapor that is drawn through an outlet of the device when anegative pressure is applied. Alternatively, it should be understoodthat the heater structure 214 of FIGS. 2A-2B may also be used in thee-vapor device 60.

FIG. 5 is a perspective view of a heater structure having a loop shapeand unrecessed portions extending in opposite directions according to anexample embodiment. Referring to FIG. 5, the heater structure 1114 maycorrespond to the heater structure 14 in FIGS. 3-4. Additionally, thefirst unrecessed portion 1120 a, the recessed portion 1122, and thesecond unrecessed portion 1120 b of FIG. 5 may correspond to the firstunrecessed portion 120 a, the recessed portion 122, and the secondunrecessed portion 120 b of FIGS. 1A-1B. The opening defined by therecessed portion 1122 is intended to receive a wick having an elongatedform. Although not shown in FIG. 5, the first unrecessed portion 1120 aand the second unrecessed portion 1120 b will be connected to a powersupply (e.g., via electrical leads). Additionally, it should beunderstood that the first unrecessed portion 1120 a and the secondunrecessed portion 1120 b may be oriented in various directions based onthe location of the electrical leads (e.g., both up, both down).Furthermore, the recessed portion 1122 may be ring-shaped or oval-shapedbased on a top or bottom view. When the recessed portion 1122 isring-shaped, the inner diameter may be equal to or less than a diameterof the wick intended to extend therethrough. Alternatively, it should beunderstood that the heater structure 214 of FIGS. 2A-2B may also beapplied to the non-limiting embodiment of FIG. 5.

FIG. 6 is a perspective view of a heater structure having a loop shapeand unrecessed portions extending in the same direction according to anexample embodiment. Referring to FIG. 6, the heater structure 314 isconfigured to be pressed against a dispensing interface 330 of apre-vapor sector of an e-vapor device. The first unrecessed portion 320a, the recessed portion 322, and the second unrecessed portion 320 b ofFIG. 6 may correspond to the first unrecessed portion 120 a, therecessed portion 122, and the second unrecessed portion 120 b of FIGS.1A-1B. Although the recessed portion 322 is shown as being formed into aloop shape, it will be appreciated that the recessed portion 322 may bemanipulated to continue to circle within itself to form a spiral shape,which will provide a greater contact area with the dispensing interface330.

The dispensing interface 330 may be a wick having a planar form. In ane-vapor device, the dispensing interface 330 may be disposed in oraround an opening (e.g., in inner tube 62) leading into the reservoir.The shape of the dispensing interface 330 and the heater structure 314making contact therewith may correspond to the shape of the opening(e.g., in inner tube 62) leading into the reservoir. Thus, if theopening has a circular shape, then the dispensing interface 330 and theheater structure 314 may also have a circular shape. In addition,because the heater structure 314 can be configured to minimize thequantity of the recessed portion 322 that does not contact thedispensing interface 330 (e.g., via the first and second unrecessedportions 320 a and 320 b), the amount of wasted heat can be decreased.

The first unrecessed portion 320 a and the second unrecessed portion 320b may function as a handle and/or as a mechanism for applying a springforce against the dispensing interface 330. For example, to apply aspring force against the dispensing interface 330, the first unrecessedportion 320 a and the second unrecessed portion 320 b may be curved orbent to allow the resilience of the underlying base wire to press therecessed portion 322 into the dispensing interface 330. Furthermore,although not shown in FIG. 6, the first unrecessed portion 320 a and thesecond unrecessed portion 320 b will be connected to a power supply(e.g., via electrical leads). During vaping, the heater structure 314will vaporize the pre-vapor formulation in the dispensing interface 330to form a vapor that is drawn through an outlet of the device when anegative pressure is applied. Alternatively, it should be understoodthat the heater structure 214 of FIGS. 2A-2B may also be applied to thenon-limiting embodiment of FIG. 6.

FIG. 7 is a perspective view of a heater structure having a winding formthat resembles a polygonal shape according to an example embodiment.Referring to FIG. 7, the heater structure 414 is configured to bepressed against a dispensing interface 430 of a pre-vapor sector of ane-vapor device. The first unrecessed portion 420 a, the recessed portion422, and the second unrecessed portion 420 b of FIG. 7 may correspond tothe first unrecessed portion 120 a, the recessed portion 122, and thesecond unrecessed portion 120 b of FIGS. 1A-1B. As shown in FIG. 7, theheater structure 414 has a winding form that resembles a polygonal shape(e.g., square, rectangle). The dispensing interface 430 may be a wickhaving a planar form. In an e-vapor device, the dispensing interface 430may be disposed in or around an opening (e.g., in inner tube 62) leadinginto the reservoir. The first unrecessed portion 420 a and the secondunrecessed portion 420 b may function as a handle and/or as a mechanismfor applying a spring force against the dispensing interface 430.Furthermore, although not shown in FIG. 7, the first unrecessed portion420 a and the second unrecessed portion 420 b will be connected to apower supply (e.g., via electrical leads). During vaping, the heaterstructure 414 will vaporize the pre-vapor formulation in the dispensinginterface 430 to form a vapor that is drawn through an outlet of thedevice when a negative pressure is applied. Alternatively, it should beunderstood that the heater structure 214 of FIGS. 2A-2B may also beapplied to the non-limiting embodiment of FIG. 7.

FIG. 8 is a perspective view of a heater structure having a winding formthat resembles a circular shape according to an example embodiment.Referring to FIG. 8, the heater structure 514 is configured to bepressed against a dispensing interface 530 of a pre-vapor sector of ane-vapor device. The first unrecessed portion 520 a, the recessed portion522, and the second unrecessed portion 520 b of FIG. 8 may correspond tothe first unrecessed portion 120 a, the recessed portion 122, and thesecond unrecessed portion 120 b of FIGS. 1A-1B. As shown in FIG. 8, theheater structure 514 has a winding form that resembles a circular shape.The dispensing interface 530 may be a wick having a planar form. In ane-vapor device, the dispensing interface 530 may be disposed in oraround an opening (e.g., in inner tube 62) leading into the reservoir.The first unrecessed portion 520 a and the second unrecessed portion 520b may function as a handle and/or as a mechanism for applying a springforce against the dispensing interface 530. Furthermore, although notshown in FIG. 8, the first unrecessed portion 520 a and the secondunrecessed portion 520 b will be connected to a power supply (e.g., viaelectrical leads). During vaping, the heater structure 514 will vaporizethe pre-vapor formulation in the dispensing interface 530 to form avapor that is drawn through an outlet of the device when a negativepressure is applied. Alternatively, it should be understood that theheater structure 214 of FIGS. 2A-2B may also be applied to thenon-limiting embodiment of FIG. 8.

In addition to the examples discussed herein, the heater structure mayhave a helical form that resembles a cylindrical shape (or even aconical shape). For instance, the base wire serves as a framework forthe heater structure and may be a cylindrical helix with the shell layercoating the base wire. The heater structure may be arranged within aninner tube (e.g., inner tube 62) of an e-vapor device such that the freelength of the helical form extends coaxially with the inner tube along aportion or an entirety thereof. Additionally, a dispensing interface(e.g., absorbent layer) may be disposed between the heater structure andthe inner tube. One or more absorbent layers (e.g., gauze) serving asthe dispensing interface may wrapped around the heater structure. Inthis non-limiting embodiment, the absorbent layer serving as thedispensing interface may be pressed against the interior surface of theinner tube via the resiliency of the heater structure. In this regard,the outer diameter of the helical form of the heater structure maycorrespond approximately to the inner diameter of the inner tube (orotherwise be appropriately sized to take into account the thickness ofthe dispensing interface) so as to exert a spring force that causes theabsorbent layer serving as the dispensing interface to be pressedagainst the interior surface of the inner tube. Furthermore, the innertube may also have one or more holes that allow pre-vapor formulationfrom the reservoir (e.g., reservoir 22) to be drawn into the dispensinginterface via capillary action. As a result, when the e-vapor device isactivated, the heater structure will vaporize the pre-vapor formulationin the dispensing interface to form a vapor that is drawn through anoutlet of the device when a negative pressure is applied. In theconfiguration, the reservoir may optionally be in a form of a filledtank that does not include a storage medium (e.g., fibrous material).

While a number of example embodiments have been disclosed herein, itshould be understood that other variations may be possible. Suchvariations are not to be regarded as a departure from the spirit andscope of the present disclosure, and all such modifications that wouldbe appreciated by one ordinarily skilled in the art based on theteachings herein are intended to be included within the scope of thefollowing claims.

1. An e-vapor device, comprising: a pre-vapor sector configured to holdand dispense a pre-vapor formulation; a heater structure arranged inthermal contact with the pre-vapor sector, the heater structureincluding a base wire and a shell layer coating the base wire, the basewire being insulated from the shell layer, the shell layer including atleast one recessed portion between a first unrecessed portion and asecond unrecessed portion, the at least one recessed portion being athinner section of the shell layer that is configured to vaporize thepre-vapor formulation to generate a vapor; and a power source includingopposite terminals connected to the first unrecessed portion and thesecond unrecessed portion of the shell layer.
 2. The e-vapor device ofclaim 1, wherein the pre-vapor sector includes a reservoir and adispensing interface.
 3. The e-vapor device of claim 2, wherein the atleast one recessed portion of the shell layer is arranged to pressagainst the dispensing interface of the pre-vapor sector.
 4. The e-vapordevice of claim 1, wherein the heater structure has a yield strengthranging from 50 to 600 MPa.
 5. The e-vapor device of claim 1, whereinthe base wire is an anodized wire.
 6. The e-vapor device of claim 5,wherein the anodized wire is an object wire coated with an anodic layer.7. The e-vapor device of claim 6, wherein the object wire is an aluminumwire, a titanium wire, a zinc wire, a magnesium wire, a niobium wire, azirconium wire, a hafnium wire, or a tantalum wire.
 8. The e-vapordevice of claim 6, wherein the anodic layer has a dielectric strength ofat least 150 V.
 9. The e-vapor device of claim 6, wherein the anodiclayer has a thickness ranging from 500 to 10,000 nm.
 10. The e-vapordevice of claim 1, wherein the base wire is a transition metal-basedwire coated with vitreous enamel.
 11. The e-vapor device of claim 10,wherein the transition metal-based wire is a nickel wire, anickel-chromium wire, or a stainless steel wire.
 12. The e-vapor deviceof claim 1, wherein the first unrecessed portion is separated from thesecond unrecessed portion by the at least one recessed portion of theshell layer, the at least one recessed portion configured to reach atemperature that is at least double a temperature of the first andsecond unrecessed portions when a current flows through the shell layer.13. The e-vapor device of claim 1, wherein a thickness of the first andsecond unrecessed portions of the shell layer ranges from 10 to 100 μm.14. The e-vapor device of claim 13, wherein a thickness of the at leastone recessed portion of the shell layer ranges from 0.01 to 1 μm. 15.The e-vapor device of claim 1, wherein the at least one recessed portionof the shell layer has a resistivity ranging from 0.02 to 0.2 μΩ·m. 16.The e-vapor device of claim 1, wherein the shell layer is formed ofplatinum or gold.
 17. The e-vapor device of claim 1, wherein the atleast one recessed portion is in a form of a first recessed portion anda second recessed portion, the first and second recessed portions beingbetween opposite sides of the first and second unrecessed portions, thefirst and second recessed portions coiling around the base wire.